The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Nov. 04, 2014
Applicant:

Innolux Corporation, Chu-Nan, Miao-Li County, TW;

Inventors:

Yueh-Ting Chung, Chu-Nan, TW;

Shao-Wu Hsu, Chu-Nan, TW;

Yung-Hsin Lu, Chu-Nan, TW;

Jyun-Yu Chen, Chu-Nan, TW;

Kuan-Yu Chiu, Chu-Nan, TW;

Chao-Hsiang Wang, Chu-Nan, TW;

Assignee:

INNOLUX CORPORATION, Jhu-Nan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/1362 (2006.01); G02F 1/1343 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/136227 (2013.01); G02F 2001/134372 (2013.01);
Abstract

An element substrate is provided, including a substrate, a metal layer, a planarization layer and a first conductive layer. The metal layer is disposed on the substrate. The planarization layer is located on the metal layer, wherein the planarization layer includes a contact hole, the contact hole has a continuous wall and a bottom, the bottom exposes the metal layer, and the bottom of the contact hole has a first width. The first conductive layer is located on the planarization layer, wherein the first conductive layer includes an opening, the opening exposes the contact hole, and the opening has a second width above the contact hole, wherein the relationship of the first width and the second width is modified to decrease illumination loss and to prevent problems of shot-circuiting and insufficient capacitance.


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