The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

May. 14, 2013
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Matthew Sean Read, Rancho Santa Margarita, CA (US);

Hoang Mong Nguyen, Fountain Valley, CA (US);

Sergio Joaquin Gonzalez, Mexicali, MX;

Luis Eduardo Herrera, Mexicali, MX;

Assignee:

SKYWORKS SOLUTIONS, INC., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/561 (2013.01); H01L 24/97 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Systems and methods disclose maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern achieves paint thickness control. A uniform coating of conductive paint provides a more effective EMI or RFI shield during the operation of the IC modules.


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