The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Mar. 13, 2013
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Alejandro Aldrin II Agcaoili Narag, Singapore, SG;

Ravi Palaniswamy, Singapore, SG;

Bee Leng Tan, Singapore, SG;

Antonny Enojo Flor, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 23/498 (2006.01); H01S 5/022 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/4985 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01S 5/02272 (2013.01); H01S 5/02276 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/12032 (2013.01);
Abstract

Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.


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