The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Jun. 15, 2014
Applicant:
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Inventors:
Takanori Yamashita, Kanagawa, JP;
Toshinori Kiyohara, Kanagawa, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/64 (2006.01); H04L 25/02 (2006.01); H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01F 19/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/4952 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H04L 25/0266 (2013.01); H01F 2019/085 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/78 (2013.01); H01L 24/83 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0612 (2013.01); H01L 2224/06164 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/48477 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78705 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/85051 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85986 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19104 (2013.01);
Abstract
In an SOP1 having a semiconductor chip and another semiconductor chip, in wire coupling between the chips, a withstand voltage can be secured by setting an inter-wire distance between a wire in a first wire group that is closest to a second wire group and a wire in the second wire group that is closest to the first wire group to be larger than an inter-wire distance between any wires in the first wire group and the second wire group, which makes it possible to attain improvement of reliability of the SOP1.