The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Feb. 22, 2016
Applicants:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Stmicroelectronics (Alps) Sas, Grenoble, FR;

Inventors:

David Auchere, St. Martin d'Heres, FR;

Laurent Marechal, Bures sur Yvette, FR;

Laurent Schwarz, La Buisse, FR;

Yvon Imbs, Quaix en Chartreuse, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/315 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 24/81 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1815 (2013.01);
Abstract

An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.


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