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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9754834 B1

PDFFull Text
Date of Patent:
Sep. 05, 2017

Filed:

Sep. 01, 2016

Method of electrically isolating leads of a lead frame strip by laser beam cutting

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Nee Wan Khoo, Melaka, MY;

Vigneswaran Letcheemana, Ipoh Perak, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Kimberly Rizkallah

Assistant Examiner:

Brian Turner

Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 21/78 (2006.01); H01L 21/301 (2006.01); H01L 21/44 (2006.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01); B23K 26/362 (2014.01); B23K 26/40 (2014.01); B23K 26/402 (2014.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); B23K 103/16 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/362 (2013.01); B23K 26/40 (2013.01); B23K 26/402 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); B23K 2201/40 (2013.01); B23K 2203/166 (2015.10); B23K 2203/50 (2015.10); H01L 22/14 (2013.01); H01L 24/97 (2013.01); H01L 2924/12042 (2013.01);
Abstract

A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to each of the die paddles, the unit lead frames are covered with a molding compound after the semiconductor dies are attached to the die paddles, and a laser beam is directed at regions of the periphery of each unit lead frame where the leads are located thereby forming spaced apart cuts in the periphery of each unit lead frame. The spaced apart cuts sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in the regions of the periphery where the leads are located so that the molding compound remains intact between the spaced apart cuts.

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