The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Apr. 19, 2016
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2223/6616 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/16 (2013.01);
Abstract
A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.