The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Dec. 07, 2015
Applicant:
Epistar Corporation, Hsinchu, TW;
Inventors:
Chih-Wei Wei, Hsinchu, TW;
Chia-Liang Hsu, Hsinchu, TW;
Assignee:
EPISTAR CORPORATION, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/68 (2006.01); B21D 37/14 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68 (2013.01); B21D 37/14 (2013.01); H01L 21/67109 (2013.01);
Abstract
A method for automatically transferring multiple semiconductor devices from a first substrate to a second substrate comprises steps of providing a first substrate on which the semiconductor device is formed, providing a second substrate directly under the first substrate, automatically moving the first substrate toward the second substrate such that the semiconductor devices are close to the second substrate; connecting the semiconductor devices to the second substrate by exerting force to the second substrate, and taking out the semiconductor devices simultaneously from the first substrate.