The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Jun. 26, 2014
Applicant:

Ningbo Yamao Lighting Electric Appliance Company Ltd., Ningbo, Zhejiang, CN;

Inventors:

MaoJun Cao, Zhejiang, CN;

Hui Chen, Zhejiang, CN;

Wei Tan, Zhejiang, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 23/00 (2015.01); H05K 1/00 (2006.01); H01L 25/16 (2006.01); H01L 33/50 (2010.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); F21Y 101/00 (2016.01); F21Y 103/33 (2016.01); F21Y 115/10 (2016.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
F21V 23/005 (2013.01); H01L 33/502 (2013.01); H05K 1/00 (2013.01); H05K 1/0274 (2013.01); H05K 1/0306 (2013.01); F21Y 2101/00 (2013.01); F21Y 2103/33 (2016.08); F21Y 2115/10 (2016.08); H01L 25/167 (2013.01); H01L 2924/0002 (2013.01); H05K 1/181 (2013.01); H05K 3/3463 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A wide-angle emitting LED driven by built-in power and an assembling method are provided. The wide-angle emitting LED includes a transparent substrate, at least one light-emitting chip, and a driving circuit component. The front of the transparent substrate is provided with a printed circuit where a portion of an upper surface of the transparent substrate is provided with a plurality of conductive bonding pads. Each of the at least one light-emitting chip is bonded on the front of the transparent substrate, and the at least one light-emitting chip is electrically connected to the conductive bonding pads by metal wires. In addition, the driving circuit component is bonded with the transparent substrate and the conductive bonding pads and is electrically connected to the conductive bonding pads by metal wires.


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