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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9752734 B1

PDFFull Text
Date of Patent:
Sep. 05, 2017

Filed:

Aug. 08, 2016

Light emitting device

Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Yuichiro Tanda, Shinjuku-ku, JP;

Toshio Matsushita, Naruto, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:

Mori & Ward, LLP

Primary Examiner:

Sean Gramling

Int. Cl.
CPC ...
F21S 4/00 (2016.01); F21V 21/00 (2006.01); F21K 9/232 (2016.01); H01L 33/62 (2010.01); H05B 33/04 (2006.01); F21V 29/70 (2015.01); F21K 9/235 (2016.01); F21V 3/02 (2006.01); F21V 9/16 (2006.01); F21V 19/00 (2006.01); F21V 31/00 (2006.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); F21Y 101/00 (2016.01); F21Y 115/30 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21K 9/232 (2016.08); F21K 9/235 (2016.08); F21V 3/02 (2013.01); F21V 9/16 (2013.01); F21V 19/006 (2013.01); F21V 29/70 (2015.01); F21V 31/005 (2013.01); H01L 25/0753 (2013.01); H01L 33/501 (2013.01); H01L 33/508 (2013.01); H01L 33/62 (2013.01); H05B 33/04 (2013.01); F21Y 2101/00 (2013.01); F21Y 2115/10 (2016.08); F21Y 2115/30 (2016.08); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01063 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/181 (2013.01);
Abstract

A light emitting device includes a board, light emitting element chips, a wavelength conversion member, a transparent bulb, support leads, and a support base. The board has a first surface and a second surface. The second surface is an opposite side to the first surface. The light emitting element chips are mounted on the first surface side. The wavelength conversion member is formed unitarily with a transparent member. The transparent bulb encloses the board and the light emitting element chips. The support leads secure the light emitting element chips inside the transparent bulb. The support base can be threadedly engaged with a conventional light bulb socket along a socket axis. The wavelength conversion member is provided on a first surface side and a second surface side, and is elongated in a longitudinal direction. The light emitting element chips is aligned along a line that extends in the longitudinal direction.

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