The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Dec. 22, 2016
Applicant:

Canon Anelva Corporation, Kawasaki-shi, JP;

Inventor:

Koji Tsunekawa, Kawasaki, JP;

Assignee:

CANON ANELVA CORPORATION, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/35 (2006.01); C23C 14/14 (2006.01); C23C 14/56 (2006.01); C23C 14/50 (2006.01); C23C 14/34 (2006.01); C23C 14/08 (2006.01); C23C 14/06 (2006.01); H01F 41/18 (2006.01); H01J 37/34 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 14/14 (2013.01); C23C 14/067 (2013.01); C23C 14/081 (2013.01); C23C 14/345 (2013.01); C23C 14/3407 (2013.01); C23C 14/505 (2013.01); C23C 14/568 (2013.01); H01F 41/18 (2013.01); H01J 37/32899 (2013.01); H01J 37/3417 (2013.01);
Abstract

The present invention provides a manufacturing apparatus which can realize so-called sequential substrate transfer and can improve throughput, even when one multi-layered thin film includes plural layers of the same film type. A manufacturing apparatus according to an embodiment of the present invention includes a transfer chamber, three sputtering deposition chambers each including one sputtering cathode, two sputtering deposition chambers each including two or more sputtering cathodes, and a process chamber for performing a process other than sputtering, and the three sputtering deposition chambers, the two sputtering deposition chambers, and the process chamber are arranged around the transfer chamber so that each is able to perform delivery and receipt of the substrate with the transfer chamber.


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