The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Dec. 10, 2012
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Daisuke Sato, Tochigi, JP;

Ryosuke Odaka, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 4/00 (2006.01); C09J 4/06 (2006.01); C09J 5/06 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H01B 1/22 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01); C09J 133/14 (2006.01); H01B 13/00 (2006.01); C09J 7/02 (2006.01);
U.S. Cl.
CPC ...
C09J 4/00 (2013.01); C09J 4/06 (2013.01); C09J 5/06 (2013.01); C09J 7/0242 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 133/14 (2013.01); H01B 1/22 (2013.01); H01B 13/00 (2013.01); H05K 3/323 (2013.01); H05K 3/361 (2013.01); C09J 2433/00 (2013.01); H05K 2203/0425 (2013.01);
Abstract

There are provided an electrically conductive adhesive agent capable of providing good electrical continuity to a substrate to which a preflux treatment has been applied, and a method for connecting electronic components. The electrically conductive adhesive agent to be used includes a polymerizable acrylic compound, an organic peroxide, and the solder particles, the organic peroxide having a one minute half-life temperature lower than the solidus temperature of the solder particles. At the time of thermocompression bonding, the solder particles are crushed and an oxide film is removed, and a preflux layer on the surface of a bump is also removed by melting and flowing thereof, whereby electrical continuity is secured, and then an adhesive component is completely cured.


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