The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Feb. 26, 2010
Applicants:

Kenichi Fukukawa, Shinagawa-ku, JP;

Masaki Okazaki, Ichihara, JP;

Yoshihiro Sakata, Ichikawa, JP;

Ichiro Fujio, Nagaokakyo, JP;

Wataru Yamashita, Ichihara, JP;

Inventors:

Kenichi Fukukawa, Shinagawa-ku, JP;

Masaki Okazaki, Ichihara, JP;

Yoshihiro Sakata, Ichikawa, JP;

Ichiro Fujio, Nagaokakyo, JP;

Wataru Yamashita, Ichihara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); C09D 179/08 (2006.01); C08G 73/10 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); C08G 73/1082 (2013.01); C09D 179/08 (2013.01); H05K 1/0346 (2013.01); Y10T 428/31681 (2015.04);
Abstract

The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).


Find Patent Forward Citations

Loading…