The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Feb. 16, 2015
Applicants:

Dow Corning Corporation, Midland, MI (US);

Dow Corning Toray Co., Ltd., Tokyo, JP;

Inventors:

Gunn Jo, Chungcheongbuk-do, KR;

Haruna Yamazaki, Ichihara-shi, KR;

Ju Young Yook, Gwanghyewon-Myeon, KR;

Makoto Yoshitake, Ichihara-shi, KR;

Assignees:

DOW CORNING TORAY CO., LTD., Chiyoda-Ku, Tokyo, JP;

DOW CORNING CORPORATION, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/38 (2006.01); H01L 23/29 (2006.01); C08G 77/20 (2006.01); C08L 83/04 (2006.01); C08G 77/08 (2006.01);
U.S. Cl.
CPC ...
C08G 77/38 (2013.01); C08G 77/20 (2013.01); C08L 83/04 (2013.01); C08G 77/08 (2013.01); C08G 2170/20 (2013.01); C08K 2201/00 (2013.01); H01L 23/296 (2013.01);
Abstract

This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.


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