The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Aug. 06, 2014
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Rudolf Beckmann, Hammersbach, DE;
Sabine Nolker, Limeshain, DE;
Assignee:
APPLE INC., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/115 (2006.01); C04B 41/87 (2006.01); C23C 16/513 (2006.01); C23C 14/34 (2006.01); H05K 5/03 (2006.01); C04B 41/50 (2006.01); C04B 41/00 (2006.01); C23C 14/08 (2006.01); C23C 16/40 (2006.01); C30B 29/20 (2006.01);
U.S. Cl.
CPC ...
H05K 5/03 (2013.01); C04B 41/009 (2013.01); C04B 41/5031 (2013.01); C23C 14/081 (2013.01); C23C 14/34 (2013.01); C23C 16/403 (2013.01); C23C 16/513 (2013.01); C30B 29/20 (2013.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01);
Abstract
A break resistant sapphire plate and a corresponding production process. The sapphire plate may include a planar sapphire substrate, and at least one shock absorbing layer arranged on a surface of the substrate. The shock absorbing layer may have a thickness of between 0.1% to 10% of the thickness of the substrate. The production process for producing the sapphire plate may include providing a planar sapphire substrate, and coating at least one surface of the substrate with a shock absorbing layer. The shock absorbing layer may include a layer thickness between 0.1% to 10% of the thickness of the substrate.