The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

May. 19, 2016
Applicant:

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Yasuaki Norimatsu, Tokyo, JP;

Akihiko Kanouda, Tokyo, JP;

Yuuichi Mabuchi, Tokyo, JP;

Takuya Ishigaki, Tokyo, JP;

Takae Shimada, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H02M 3/335 (2006.01); H02M 7/49 (2007.01); H02M 7/48 (2007.01); H02M 7/487 (2007.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H05K 1/0207 (2013.01); H05K 7/20909 (2013.01); H02M 3/335 (2013.01); H02M 7/487 (2013.01); H02M 7/4807 (2013.01); H02M 7/49 (2013.01); Y02B 70/1433 (2013.01);
Abstract

Size and weight reduction of a transformer for system interconnection is needed. Applying an SST to the transformer can reduce the size and weight. However, it is also necessary to flexibly handle a wide range of voltages to match a high-voltage system or motor, reduce switching loss of a power device used in a power circuit such as a DC/DC converter and an inverter in association with frequency increase caused by application of the SST, and achieve size reduction of a cooling structure. Further, it is necessary to boost a voltage to a system voltage and reduce the size and weight of a large current path before the voltage boosting. Thus, an LLC resonant converter structure is applied, and a multiple-connection structure is employed in each of which a converter is arranged for an input or an inverter is arranged for an output. This enables handling of various voltage ranges by various combinations of the numbers of multiple connections of the inputs and the outputs. An insulation cooling structure is provided by a wind-tunnel structure in which two input and output substrates are opposed and are connected by insulation members, and another wind-tunnel structure arranged in the downstream of the wind-tunnel structure and including the LLC resonant structure therein. The wind-tunnel structures are integrated with each other.


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