The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
May. 11, 2016
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Akira Akiba, Kanagawa, JP;
Mitsuo Hashimoto, Kanagawa, JP;
Shinya Morita, Tokyo, JP;
Shun Mitarai, Kanagawa, JP;
Mikihiro Taketomo, Kanagawa, JP;
Kazunao Oniki, Tokyo, JP;
Koichi Ikeda, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6599 (2011.01); H01R 13/66 (2006.01); H01P 3/08 (2006.01); H01P 3/12 (2006.01); H01R 24/64 (2011.01); H05K 1/02 (2006.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6691 (2013.01); H01P 3/08 (2013.01); H01P 3/085 (2013.01); H01P 3/121 (2013.01); H01R 13/6599 (2013.01); H01R 24/64 (2013.01); H01R 2107/00 (2013.01); H05K 1/0219 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09336 (2013.01); H05K 2201/09618 (2013.01);
Abstract
A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.