The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Sep. 16, 2014
Applicant:
Sony Corporation, Tokyo, JP;
Inventor:
Hirofumi Kawamura, Chiba, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01P 1/04 (2006.01); H01P 5/08 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0075 (2013.01); H01L 23/66 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H01P 1/047 (2013.01); H01P 5/08 (2013.01); H05K 1/025 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6633 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19032 (2013.01); H01L 2924/19039 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30111 (2013.01); H05K 1/0219 (2013.01); H05K 1/0243 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10166 (2013.01); H05K 2203/049 (2013.01);
Abstract
Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.