The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Nov. 23, 2015
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventor:

Kuang-Jung Chen, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H01L 51/52 (2006.01); B32B 7/14 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); B32B 7/14 (2013.01); H01L 51/5253 (2013.01); B32B 2307/748 (2013.01); B32B 2457/00 (2013.01); H01L 2251/5338 (2013.01); H01L 2924/0002 (2013.01); Y10T 156/10 (2015.01); Y10T 156/109 (2015.01); Y10T 428/1476 (2015.01);
Abstract

An environmentally sensitive electronic device package including a first adhesive, at least one first side wall barrier, a first substrate, and a second substrate is provided. The first adhesive has a first surface and a second surface opposite to the first surface. The first side wall barrier is distributed in the first adhesive. The first substrate is bonded with the first surface. The first substrate has an environmentally sensitive electronic device formed thereon and the environmentally sensitive electronic device is surrounded by the first side wall barrier. The second substrate is bonded with the second surface. A manufacturing method of the environmentally sensitive electronic device package is also provided.


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