The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Jun. 06, 2014
Applicant:

Würth Elektronik Gmbh & Co. KG, Niedernhall, DE;

Inventors:

Jan Kostelnik, Kirchberg, DE;

Jürgen Wolf, Kupferzell, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/048 (2014.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H01L 31/05 (2014.01); H01L 31/18 (2006.01); H01L 51/56 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5237 (2013.01); H01L 24/19 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02008 (2013.01); H01L 31/048 (2013.01); H01L 31/05 (2013.01); H01L 31/1884 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 51/0022 (2013.01); H01L 51/5203 (2013.01); H01L 51/56 (2013.01); H05K 1/0274 (2013.01); H05K 1/144 (2013.01); H05K 1/185 (2013.01); H01L 51/524 (2013.01); H01L 2251/5369 (2013.01); H01L 2924/12044 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); Y02E 10/50 (2013.01);
Abstract

The invention relates to a method for producing an optical module, comprising the following steps: a) providing a chip having an optical element integrated in the chip, wherein the optical element bas a first electrode and a second electrode, and wherein the chip has a first connection contact for the first electrode and a second connection contact for the second electrode, such that an operating voltage for the optical element can be applied between the first connection contact and the second connection contact, and wherein the chip has an optically active side, which is designed to emit and/or to receive radiation; b) connecting the chip to a film, such that the film completely covers the optically active side of the chip, wherein the film is a film made from acrylate, polyarylate, or polyurethane, wherein the film, at least in the region located above the optically active side, is transparent to radiation which. when operating voltage is applied, can be emitted or received by the optical element; c) contacting the first connection contact of the chip by means of a conducting track arranged on the film and contacting the second connection contact by means of an additional conducting track.


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