The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Feb. 27, 2014
Applicant:

Flextronics Ap, Llc, Broomfield, CO (US);

Inventors:

Samuel Tam, Daly City, CA (US);

Murad Kurwa, San Jose, CA (US);

Shing Dick Pang Tak, Tsuen Wan, HK;

Assignee:

Flextronics AP, LLC, Broomfield, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/64 (2010.01); F21K 9/90 (2016.01); H01L 33/62 (2010.01); F21V 29/77 (2015.01); F21K 9/20 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); F21K 9/90 (2013.01); F21K 9/20 (2016.08); F21V 29/773 (2015.01); F21Y 2115/10 (2016.08); H01L 33/62 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An LED device and method of manufacture including separately coupling a thin flexible interposer and an LED die to a heat sink structure and then electrically coupling the interposer and the LED die together with a wirebond. A specifically shaped perimeter of an aperture within the interposer negates the need for a cavity or alignment markings within the heat sink structure by limiting the orientation in which the die fits within the aperture. Alternatively, an LED device and method of manufacture include coupling a rigid circuit board to an LED die such that electrical contacts of the die are electrically coupled with electrical input/output terminals of the circuit board. This die/board unit is then able to be coupled to a heat sink structure to form a portion of the device.


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