The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Aug. 12, 2014
Applicant:

Lumens Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Seung-Hyun Oh, Gwangju-si, KR;

Pyoung-Gug Kim, Hwaseong-si, KR;

Yun-Geon Cho, Osan-si, KR;

Chun-Ki Min, Yongin-si, KR;

Chul-Yeun Choi, Yongin-si, KR;

Dae-Gil Jung, Osan-si, KR;

Assignee:

LUMENS CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/50 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01L 27/15 (2006.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 27/156 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/64 (2013.01); H01L 2224/73265 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

There are provided a chip-on-board type light emitting device package capable of improving structural reliability and heat-dissipating efficiency and reducing a manufacturing cost, and a method for manufacturing the same. The chip-on-board type light emitting device package includes: a dual frame including a base frame on which a plurality of light emitting devices are mounted and an electrode frame positioned above the base frame so as to be spaced apart from the base frame and including two electrodes separated from each other; and a molding part coupled to the dual frame so that the base frame and the electrode frame are spaced apart from each other and having an opening through which light generated in the plurality of light emitting devices is to be emitted, wherein the base frame has a through-hole through which the electrode frame is exposed.


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Oh, Seung-Hyun. (2017). Method for manufacturing improved chip-on-board type light emitting device package and such manufactured chip-on-board type light emitting device package (U.S. Patent No. 9748459). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9748459

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