The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Sep. 26, 2014
Applicant:

Conti Temic Microelectronic Gmbh, Nuremberg, DE;

Inventors:

Martin Steinau, Nuremberg, DE;

Thomas Schmidt, Burglengenfeld, DE;

Bernhard Schuch, Neusitz, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 25/16 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/162 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/49531 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 25/165 (2013.01); H05K 1/148 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49173 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H05K 3/284 (2013.01); H05K 2201/068 (2013.01); H05K 2203/1316 (2013.01);
Abstract

A circuit device has a base plate, a first substrate arranged on a first outer side of the base plate, a second substrate arranged on a second outer side opposite the first outer side of the base plate, at least one electrical connection element that electrically connects the first substrate and the second substrate, at least one electronic component arranged on or in the first substrate, at least one electronic component arranged on or in the second substrate, a mold package molded around the two substrates and the electronic components arranged thereon, and at least one contacting element for electrically contacting the first substrate and/or the second substrate. The at least one contacting element is electrically conductively connected to the first substrate and/or the second substrate and is led out from the mold package.


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