The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Oct. 19, 2015
Applicant:

Genesis Photonics Inc., Tainan, TW;

Inventors:

Cheng-Yen Chen, Tainan, TW;

Yun-Li Li, Taipei, TW;

Po-Jen Su, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 24/14 (2013.01); H01L 33/62 (2013.01); H01L 27/156 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.


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