The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Dec. 21, 2016
Applicant:

The Silanna Group Pty Ltd, Eight Mile Plains, Queensland, AU;

Inventors:

Norbert Krause, Hawthorne, AU;

Yashodhan Vijay Moghe, Marsfield, AU;

Assignee:

The Silanna Group Pty Ltd, Eight Mile Plains, Queensland, AU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 25/50 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06541 (2013.01);
Abstract

An electronic circuit structure is formed with first and second dies bonded together. A first active layer is formed in the first die, and a second active layer is formed in the second die. The first and second dies are bonded together, with an isolation capacitor, through which the first and second active layers communicate, disposed between the first and second dies.


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