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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9748192 B1

PDFFull Text
Date of Patent:
Aug. 29, 2017

Filed:

Oct. 27, 2014

Printed circuit board having a post bump

Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Ji Haeng Lee, Seoul, KR;

Dong Sun Kim, Seoul, KR;

Sung Wuk Ryu, Seoul, KR;

Assignee:

LG INNOTEK CO., LTD., Seoul, KR;

Attorney:

Saliwanchik, Lloyd & Eisenschenk

Primary Examiner:

Kimberly Rizkallah

Assistant Examiner:

Dilinh Nguyen

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16059 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/351 (2013.01);
Abstract

Provided are a printed circuit board which can be used as a substrate for a package, a method of manufacturing the printed circuit board, and a semiconductor package using the printed circuit board, the printed circuit board including: a first substrate having a first mounting area for mounting a package substrate and a second mounting area for mounting a semiconductor element; a single layer or multi-layered circuit pattern of the first substrate; and a post bump connected to the circuit pattern, provided on an external insulating layer of the first mounting area, and having a concave upper surface.

Find Patent Forward Citations

Lee, Ji. (2017). Printed circuit board having a post bump (U.S. Patent No. 9748192). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9748192

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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