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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9748178 B1

PDFFull Text
Date of Patent:
Aug. 29, 2017

Filed:

Nov. 18, 2015

Semiconductor device, solid-state imaging device, and imaging device

Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Mitsuhiro Tsukimura, Tokyo, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Eduardo A Rodela

Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/66 (2006.01); H01L 27/32 (2006.01); H01L 27/146 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 22/30 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/3251 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/10135 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/8113 (2013.01); H01L 2224/81132 (2013.01); H01L 2224/81191 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06593 (2013.01);
Abstract

A semiconductor device includes a first substrate, a second substrate, a connection part, and an alignment mark. The connection part includes a first electrode which is disposed on the first substrate, a second electrode which is disposed on the second substrate, and a connection bump which connects the first electrode and the second electrode. The alignment mark includes a first mark which is disposed on the first substrate and a second mark which is disposed on the second substrate. A sum of a height of the first mark and a height of the second mark is substantially equal to a sum of a height of the first electrode, a height of the second electrode, and a height of the connection bump.

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