The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Feb. 22, 2016
Applicants:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Stmicroelectronics (Alps) Sas, Grenoble, FR;

Inventors:

Yvon Imbs, Quaix En Chartreuse, FR;

Laurent Schwarz, La Buisse, FR;

David Auchere, St. Martin d'Heres, FR;

Laurent Marechal, Bures sur Yvette, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 21/3105 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/3105 (2013.01); H01L 21/56 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/3135 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/8538 (2013.01); H01L 2924/14 (2013.01);
Abstract

An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.


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