The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Jan. 31, 2013
Applicants:

Banqiu Wu, Sunnyvale, CA (US);

Nag B. Patibandla, Pleasanton, CA (US);

Toshiaki Fujita, Sakura, JP;

Ralf Hofmann, Soquel, CA (US);

Pravin K. Narwankar, Sunnyvale, CA (US);

Jeonghoon OH, San Jose, CA (US);

Srinivas Satya, Sunnyvale, CA (US);

Li-qun Xia, Cupertino, CA (US);

Inventors:

Banqiu Wu, Sunnyvale, CA (US);

Nag B. Patibandla, Pleasanton, CA (US);

Toshiaki Fujita, Sakura, JP;

Ralf Hofmann, Soquel, CA (US);

Pravin K. Narwankar, Sunnyvale, CA (US);

Jeonghoon Oh, San Jose, CA (US);

Srinivas Satya, Sunnyvale, CA (US);

Li-Qun Xia, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); H01L 21/00 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/54 (2006.01);
U.S. Cl.
CPC ...
H01L 21/673 (2013.01); C23C 16/4558 (2013.01); C23C 16/4584 (2013.01); C23C 16/45546 (2013.01); C23C 16/54 (2013.01); H01L 21/677 (2013.01); H01L 21/67346 (2013.01);
Abstract

A processing chamber having a plurality of movable substrate carriers stacked therein for continuously processing a plurality of substrates is provided. The movable substrate carrier is capable of being transported from outside of the processing chamber, e.g., being transferred from a load luck chamber, into the processing chamber and out of the processing chamber, e.g., being transferred into another load luck chamber. Process gases delivered into the processing chamber are spatially separated into a plurality of processing slots, and/or temporally controlled. The processing chamber can be part of a multi-chamber substrate processing system.


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