The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Nov. 12, 2015
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Terunao Hanaoka, Suwa, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/525 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 23/293 (2013.01); H01L 23/3171 (2013.01); H01L 23/3192 (2013.01); H01L 23/525 (2013.01); H01L 23/53295 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An aspect of the invention is an electronic component including a semiconductor substratethat has an electrode pad, a first resin layerand a third resin layerthat are located above the semiconductor substrate, a second resin layerthat is formed such that at least portions of the second resin layer are located on the first resin layer and the third resin layer, a resin projectionthat includes the first to third resin layers and is higher than the first resin layer, and a wiring layerthat is electrically connected to the electrode pad and lies above the resin projection.