The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Jun. 03, 2014
Applicant:

The United States of America, As Represented BY Sec. of the Army, Washington, DC (US);

Inventors:

Randy A. Mrozek, Baltimore, MD (US);

Joesph L. Lenhart, Port Deposit, MD (US);

Geoffrey A. Slipher, Baltimore, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); H01B 1/24 (2006.01); H01B 3/30 (2006.01); H01B 3/44 (2006.01); H01B 3/40 (2006.01); H01B 3/28 (2006.01); H01B 3/46 (2006.01); B64D 17/02 (2006.01);
U.S. Cl.
CPC ...
H01B 1/24 (2013.01); B64D 17/02 (2013.01); H01B 1/22 (2013.01); H01B 3/28 (2013.01); H01B 3/30 (2013.01); H01B 3/305 (2013.01); H01B 3/306 (2013.01); H01B 3/40 (2013.01); H01B 3/441 (2013.01); H01B 3/442 (2013.01); H01B 3/443 (2013.01); H01B 3/445 (2013.01); H01B 3/447 (2013.01); H01B 3/46 (2013.01);
Abstract

The present invention generally relates to deformable polymer composites, and more particularly to, deformable polymer composites with controlled electrical performance during deformation through tailored strain-dependent conductive filler contact. According to embodiments, a deformable elastomeric conductive material includes: an elastomeric polymer matrix; and conductive filler material uniformly dispersed in the elastomeric polymer matrix sufficient to render the material electrically or thermally conductive. The conductive filler material comprises a plurality of substantially non-entangled particles having an aspect ratio sufficiently large to enable the particles to substantially remain in contact and/or in close proximity with adjacent particles so as to maintain conductive pathways in the material when the material is subjected to deformation up to and exceeding 10% strain.


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