The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Jan. 30, 2015
Applicant:

Phononic Devices, Inc., Durham, NC (US);

Inventors:

Jesse W. Edwards, Wake Forest, NC (US);

Robert B. Allen, Winston-Salem, NC (US);

Daniel Swann, Cockeysville, MD (US);

Assignee:

Phononic Devices, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); F28D 15/02 (2006.01); F28F 13/00 (2006.01); F28D 15/04 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0266 (2013.01); F28D 15/0275 (2013.01); F28D 15/046 (2013.01); F28F 13/003 (2013.01);
Abstract

The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.


Find Patent Forward Citations

Loading…