The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Jun. 22, 2012
Applicants:
Seok Min Kang, Seoul, KR;
Moo Seong Kim, Seoul, KR;
Inventors:
Seok Min Kang, Seoul, KR;
Moo Seong Kim, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 1/02 (2006.01); C30B 25/16 (2006.01); H01L 21/02 (2006.01); C23C 16/46 (2006.01); H01L 21/324 (2006.01); C30B 33/00 (2006.01); C30B 33/02 (2006.01);
U.S. Cl.
CPC ...
C30B 25/16 (2013.01); C23C 16/463 (2013.01); C30B 33/00 (2013.01); C30B 33/02 (2013.01); H01L 21/0262 (2013.01); H01L 21/02378 (2013.01); H01L 21/02433 (2013.01); H01L 21/02532 (2013.01); H01L 21/02664 (2013.01); H01L 21/324 (2013.01);
Abstract
A method of fabricating a wafer according to the embodiment comprises the steps of growing an wafer on a surface of the wafer in a growth temperature; and cooling the wafer after the wafer has been grown, wherein a stepwise cooling is performed when cooling the wafer.