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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9745498 B1

PDFFull Text
Date of Patent:
Aug. 29, 2017

Filed:

Oct. 20, 2014

Heat-storage composition

Applicants:

Fuji Polymer Industries Co., Ltd., Nagoya-shi, Aichi, JP;

Riken, Wako-shi, Saitama, JP;

Inventors:

Tomoki Matsumura, Aichi, JP;

Masakazu Hattori, Aichi, JP;

Seiji Niitaka, Saitama, JP;

Kimitoshi Kono, Saitama, JP;

Assignees:

Fuji Polymer Industries Co., Ltd., Aichi, JP;

RIKEN, Saitama, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Margaret Moore

Int. Cl.
CPC ...
C08K 3/36 (2006.01); C09K 5/06 (2006.01); C08K 3/00 (2006.01); C08L 101/00 (2006.01); C09K 5/00 (2006.01); C08K 9/06 (2006.01); H01L 23/427 (2006.01); C08K 3/22 (2006.01); C08K 3/18 (2006.01); C08K 3/28 (2006.01);
U.S. Cl.
CPC ...
C09K 5/063 (2013.01); C08K 3/00 (2013.01); C08K 3/0008 (2013.01); C08K 9/06 (2013.01); C08L 101/00 (2013.01); C09K 5/00 (2013.01); H01L 23/427 (2013.01); H01L 23/4275 (2013.01); C08K 3/18 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01);
Abstract

A heat storage composition () of the present invention includes a matrix resin () and heat storage inorganic particles (). The heat storage inorganic particles () are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition. The amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin. The heat conductivity of the heat storage composition is 0.3 W/m·K or more. The heat storage composition may further include heat conductive particles (). The heat storage inorganic particles are preferably metal oxide particles containing vanadium as the main metal component. The heat storage composition has high heat storage properties and high heat conduction properties, and is used as a heat storage silicone material provided between a heat generating component and a case. Since heat from the heat generating component is temporarily stored in the heat storage composition so that the heat conduction is delayed, the heat is diffused during the delay to eliminate partial heating, thereby resulting in uniform heat dissipation.

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