The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Jun. 05, 2013
Applicant:

Mitsubishi Engineering-plastics Corporation, Tokyo, JP;

Inventors:

Atsushi Motegi, Hiratsuka, JP;

Hiroyoshi Maruyama, Hiratsuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 69/00 (2006.01); C08L 47/00 (2006.01); H01Q 1/22 (2006.01); C08K 3/40 (2006.01); C08K 7/14 (2006.01); C08K 9/06 (2006.01); C08L 83/04 (2006.01); H05K 3/18 (2006.01); B41C 1/05 (2006.01); B41M 5/26 (2006.01); C08G 77/12 (2006.01);
U.S. Cl.
CPC ...
C08L 69/00 (2013.01); C08K 3/40 (2013.01); C08K 7/14 (2013.01); C08K 9/06 (2013.01); C08L 47/00 (2013.01); C08L 83/04 (2013.01); H01Q 1/22 (2013.01); H05K 3/185 (2013.01); B41C 1/05 (2013.01); B41M 5/267 (2013.01); C08G 77/12 (2013.01); H05K 2203/107 (2013.01); Y10T 29/49016 (2015.01); Y10T 428/31507 (2015.04);
Abstract

Provided is a resin composition excellent in mechanical strength while maintaining LDS activity. The resin composition for laser direct structuring comprises, relative to 100 parts by weight of a polycarbonate resin component, 10 to 100 parts by weight of a glass filler and 1 to 30 parts by weight of a laser direct structuring additive, wherein the polycarbonate resin component consists of 80 to 30% by weight of a polycarbonate resin and 20 to 70% by weight of a styrene-based resin, or consists of a polycarbonate; and the laser direct structuring additive comprises antimony and tin.


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