The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Jul. 26, 2013
Applicant:

Hewlett-packard Development Company, L.p., Fort Collins, CO (US);

Inventors:

Greg S. Smith, Jr., San Diego, CA (US);

Ben Wynne, San Diego, CA (US);

Guang Jin Li, San Diego, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2006.01); C08L 29/04 (2006.01); B33Y 70/00 (2015.01); C23C 14/34 (2006.01); B29K 31/00 (2006.01); B29K 67/00 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
C08L 29/04 (2013.01); B29C 67/0092 (2013.01); B33Y 70/00 (2014.12); C23C 14/34 (2013.01); B29K 2031/04 (2013.01); B29K 2067/046 (2013.01); B29L 2009/00 (2013.01);
Abstract

The present disclosure provides composite support material and associated methods used in the fabrication of three-dimensional objects. In one example, a composite support material for three-dimensional printing can include a soluble filament core that is soluble in a solvent and is encapsulated with an insoluble shell that is insoluble in the solvent. The composite support material is stable in air and, when printed, is dissolvable in the solvent.


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