The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Feb. 06, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kazuhiro Yamada, Yokohama, JP;

Takuto Moriguchi, Kamakura, JP;

Zentaro Tamenaga, Sagamihara, JP;

Shuzo Iwanaga, Kawasaki, JP;

Takatsugu Moriya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 29/377 (2006.01); B41J 2/045 (2006.01); B41J 2/14 (2006.01); B41J 2/155 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04528 (2013.01); B41J 2/0458 (2013.01); B41J 2/04563 (2013.01); B41J 2/04581 (2013.01); B41J 2/1408 (2013.01); B41J 2/155 (2013.01); B41J 2202/12 (2013.01); B41J 2202/20 (2013.01);
Abstract

Provided is a liquid ejection head including: a plurality of recording element substrates including energy generating elements that generate ejection energy for ejecting liquid from ejection orifices; a first support member that supports the plurality of recording element substrates such that the recording element substrates are arranged in one or more lines on a main surface of the first support member; and a second support member that supports the first support member on a surface opposite to the main surface. A first thermal resistance concerning an in-plane direction parallel to the main surface, of a region between the recording element substrates in the first support member is higher than a second thermal resistance concerning a thickness direction of the second support member, of a projection region that overlaps with each recording element substrate in the second support member.


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