The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Jan. 16, 2017
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Moushumi Shome, Kent, WA (US);
Adriana Willempje Blom, Shoreline, WA (US);
Sahrudine Apdalhaliem, Seattle, WA (US);
Waeil M. Ashmawi, Bellevue, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B29C 65/00 (2006.01); B32B 41/00 (2006.01); B32B 37/00 (2006.01); B29C 65/50 (2006.01); B29C 35/08 (2006.01); B29C 65/14 (2006.01); B29C 73/10 (2006.01); B29C 73/12 (2006.01); B29C 73/34 (2006.01); B32B 37/06 (2006.01); B29K 101/10 (2006.01); B29K 63/00 (2006.01); B29K 105/00 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 66/9141 (2013.01); B29C 35/0805 (2013.01); B29C 65/1425 (2013.01); B29C 65/1467 (2013.01); B29C 65/4835 (2013.01); B29C 65/5021 (2013.01); B29C 65/5028 (2013.01); B29C 65/5057 (2013.01); B29C 66/0342 (2013.01); B29C 66/12463 (2013.01); B29C 66/7212 (2013.01); B29C 66/72141 (2013.01); B29C 66/72323 (2013.01); B29C 66/91216 (2013.01); B29C 66/91221 (2013.01); B29C 66/91411 (2013.01); B29C 66/91443 (2013.01); B29C 66/949 (2013.01); B29C 66/961 (2013.01); B29C 66/9672 (2013.01); B29C 73/10 (2013.01); B29C 73/12 (2013.01); B29C 73/34 (2013.01); B32B 37/0046 (2013.01); B32B 37/06 (2013.01); B32B 41/00 (2013.01); B29C 2035/0855 (2013.01); B29K 2063/00 (2013.01); B29K 2101/10 (2013.01); B29K 2105/0097 (2013.01); B29L 2031/3082 (2013.01); B29L 2031/3085 (2013.01); B29L 2031/3091 (2013.01);
Abstract
A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.