The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Mar. 15, 2013
Applicant:

Mitsui Chemicals, Inc., Minato-ku, Tokyo, JP;

Inventors:

Hiroshi Okumura, Ichihara, JP;

Kiminori Uchida, Ichihara, JP;

Kazuki Kimura, Ichihara, JP;

Goro Inoue, Sodegaura, JP;

Takeharu Isaki, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); B32B 15/20 (2006.01); B32B 15/085 (2006.01); B29C 45/14 (2006.01); B32B 3/30 (2006.01); B32B 15/18 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 3/26 (2006.01); B29K 23/00 (2006.01); B29K 105/00 (2006.01); B29K 705/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14311 (2013.01); B29C 45/14778 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 15/085 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/32 (2013.01); B29K 2023/06 (2013.01); B29K 2023/08 (2013.01); B29K 2023/12 (2013.01); B29K 2105/0085 (2013.01); B29K 2705/00 (2013.01); B32B 2250/03 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2307/542 (2013.01); B32B 2509/10 (2013.01); B32B 2605/00 (2013.01); Y10T 428/24545 (2015.01); Y10T 428/265 (2015.01);
Abstract

In a complex of the invention, a resin member made of a resin material including a polyolefin and a metal member are joined together through a primer layer. In addition, the resin member is obtained by molding the resin material by injection, a coexistence layer in which a primer resin material configuring the primer layer and the resin material coexist is formed between the primer layer and the resin member, and a thickness of the coexistence layer is in a range of more than or equal to 5 nm and less than or equal to 50 nm.


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