The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Dec. 01, 2011
Applicants:

Akihiro Naito, Hiroshima, JP;

Kenichi Furuki, Hiroshima, JP;

Hiroshi Ito, Hiroshima, JP;

Kazutoshi Yakemoto, Hiroshima, JP;

Inventors:

Akihiro Naito, Hiroshima, JP;

Kenichi Furuki, Hiroshima, JP;

Hiroshi Ito, Hiroshima, JP;

Kazutoshi Yakemoto, Hiroshima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/02 (2006.01); B29C 33/38 (2006.01); B29C 33/42 (2006.01); B29C 39/24 (2006.01); B29C 39/26 (2006.01); B29C 39/42 (2006.01); B29C 41/36 (2006.01); B29C 41/50 (2006.01); B81C 99/00 (2010.01); B29C 43/34 (2006.01); B29C 43/52 (2006.01); B29C 45/26 (2006.01); B29C 43/58 (2006.01); B29C 59/02 (2006.01);
U.S. Cl.
CPC ...
B29C 43/02 (2013.01); B29C 33/3857 (2013.01); B29C 33/424 (2013.01); B29C 39/24 (2013.01); B29C 39/26 (2013.01); B29C 39/42 (2013.01); B29C 41/36 (2013.01); B29C 41/50 (2013.01); B29C 43/021 (2013.01); B29C 43/34 (2013.01); B29C 43/52 (2013.01); B29C 45/263 (2013.01); B81C 99/0085 (2013.01); B29C 2043/025 (2013.01); B29C 2043/3438 (2013.01); B29C 2043/5816 (2013.01); B29C 2059/023 (2013.01); B81B 2207/056 (2013.01);
Abstract

A method for manufacturing a molded product with fine structure includes steps of, in a temperature-controlled stamper mold provided with a fine structure including a concavo-convex pattern having a width of 10 nm to 1 μm, forming a thermoplastic molten polymer layer to be in contact with the fine structureof the stamper mold having been kept at a predetermined temperature and holding the thermoplastic molten polymer layer for a predetermined time so as to transfer the fine structure of the stamper mold to the thermoplastic molten polymer layer under gravity.


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