The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Jul. 21, 2015
Applicant:
Lg Siltron Incorporated, Gumi-si, Gyeongsangbuk-do, KR;
Inventor:
Kee Yun Han, Gumi-si, KR;
Assignee:
LG SILTRON INCORPORATED, Gumi, Gyeongsangbuk-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/00 (2012.01); B24B 41/00 (2006.01); B24B 37/28 (2012.01); B24B 37/08 (2012.01); B24B 37/02 (2012.01); B24B 37/34 (2012.01); B24B 37/005 (2012.01); B24B 7/17 (2006.01);
U.S. Cl.
CPC ...
B24B 41/005 (2013.01); B24B 37/022 (2013.01); B24B 37/08 (2013.01); B24B 37/28 (2013.01); B24B 37/345 (2013.01); B24B 7/17 (2013.01); B24B 37/005 (2013.01);
Abstract
A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.