The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Dec. 01, 2015
Applicant:

Antaya Technology Corporation, Cranston, RI (US);

Inventor:

Fernando Almeida, Rehoboth, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/018 (2006.01); C22B 7/00 (2006.01); C22B 1/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/018 (2013.01); C22B 1/005 (2013.01); C22B 7/003 (2013.01); Y02P 10/212 (2015.11); Y02W 30/54 (2015.05);
Abstract

A method for recovering solder from solder coated scrap pieces includes a step of containing a quantity of solder coated scrap pieces within a centrifuge receptacle of a first centrifuge. The centrifuge receptacle has perforation holes and is rotatably mounted about a first centrifuge axis. A solder collection container surrounds the centrifuge receptacle. The method further includes the steps of heating the solder coated scrap pieces and melting the solder thereon with a heater surrounding the solder collection container and with a drive system, rotating the centrifuge receptacle while the first centrifuge axis is in about a horizontal position at a low speed and tumbling the scrap pieces along a longitudinal length of the centrifuge receptacle, and later rotating the centrifuge receptacle at a high speed for centrifugally extracting molten solder from the centrifuge receptacle, radially outwardly through the perforation holes into the solder collection container.


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