The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

May. 27, 2015
Applicant:

Paul W Harrison, Los Angeles, CA (US);

Inventor:

Paul W Harrison, Los Angeles, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); C09D 11/322 (2014.01); B41M 5/26 (2006.01);
U.S. Cl.
CPC ...
B05D 3/065 (2013.01); B41M 5/262 (2013.01); B41M 5/267 (2013.01); C09D 11/322 (2013.01); B05D 3/067 (2013.01); B41M 2205/04 (2013.01); Y10T 428/24893 (2015.01);
Abstract

Methods and compositions are disclosed for quickly creating durable surface marks and/or decorations on substrates including metal, glass, ceramic, porcelain, natural and engineered stone, as well as plastics, polymer composites and other organic materials with color, high resolution and high contrast using inkjet technology and laser, NIR diode or UV LED energy. The improved methods and compositions are based on established and emerging sub-micron and nanoparticle technology. Most properties of nanoparticles are size dependent and do not become apparent until the particle size has been reduced to the nanometer scale. Examples of such properties include increased specific surface area, facilitating the absorption and/or scattering of visible light and laser, NIR diode or UV LED energy and the decreased melting point of such materials when their particle size is reduced to the nanometer scale. Improved results such as smoothness and durability are obtained by using nanoparticles of silica, pigments and other materials in such marking processes.


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