The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Nov. 18, 2015
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Robyn Rebecca Reed McLaughlin, Seattle, WA (US);
Jeffrey Taylor Stellman, San Francisco, CA (US);
Andrew Hill, Redmond, WA (US);
Microsoft Technology Licensing, LLC, Redmond, WA (US);
Abstract
Heat dissipation configurations and methods are described herein. Certain electronic devices may include an individual piece of thermally conductive material having a first surface and a second surface. A first section of the thermally conductive material may be positioned between a motherboard and a backing layer of an electronic device such that the first surface of the first section is adjacent to the motherboard and the second surface of the first section is adjacent to the backing layer. A second section of the thermally conductive material may be positioned between a display module and a battery of the electronic device such that the first surface of the second section is adjacent to a back plate of the display module and the second surface of the second section is adjacent to the battery. The thermally conductive material may be configured to transfer heat between the first section and the second section.