The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Sep. 30, 2015
Applicant:

Nippon Mektron, Ltd., Minato-ku, Tokyo, JP;

Inventor:

Fumihiko Matsuda, Tokyo, JP;

Assignee:

NIPPON MEKTRON, LTD., Minato-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01); H01P 11/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/42 (2013.01); H01P 3/085 (2013.01); H05K 1/0225 (2013.01); H05K 1/028 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/09681 (2013.01);
Abstract

A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, and a pair of ground layers and, includes a pleated part PL having a plurality of curved portions which are curved so as to be opened or closed, in which in the ground layers, mesh ground layers in which conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, in which the mesh ground layers are arranged on an outer peripheral side of the curved portions PL, and the solid ground layers are arranged on an inner peripheral side of the curved portions.


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