The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Jul. 14, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Chikara Azuma, Ibaraki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H01G 2/06 (2006.01); H01G 4/06 (2006.01); H01G 4/30 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 3/42 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/303 (2013.01); H01G 2/065 (2013.01); H01G 4/06 (2013.01); H01G 4/30 (2013.01); H01L 23/49822 (2013.01); H01L 23/50 (2013.01); H01L 24/73 (2013.01); H05K 1/0231 (2013.01); H05K 1/162 (2013.01); H05K 1/185 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/30105 (2013.01); H05K 1/181 (2013.01); H05K 3/4602 (2013.01); H05K 3/4688 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/10643 (2013.01); H05K 2201/10674 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A plurality of electrically conductive material layers and a plurality of dielectric layers are alternately stacked on a second substrate. The plurality of electrically conductive material layers comprise first and second patterns. The first pattern comprises at least a first pair of overlaying areas free of the electrically conductive material, and the second pattern comprises at least a second pair of overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. The plurality of electrically conductive material layers are electrically isolated from one another by the dielectric layers.


Find Patent Forward Citations

Loading…