The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Apr. 01, 2009
Kenichi Mori, Tokyo, JP;
Shoichi Ito, Tokyo, JP;
Kenichi Mori, Tokyo, JP;
Shoichi Ito, Tokyo, JP;
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Abstract
A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e). The resin composition is for use in a printed wiring board for high multilayer and high frequency, and is excellent in moldability, electric characteristics, peel strength, flame resistance and heat resistance after moisture absorption. Further, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film.