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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9742373 B1

PDFFull Text
Expired
Date of Patent:
Aug. 22, 2017

Filed:

Oct. 31, 2012

Method of manufacturing a temperature-compensated micromechanical resonator

Applicant:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Inventors:

Mina Raieszadeh, Ann Arbor, MI (US);

Zhengzheng Wu, Ann Arbor, MI (US);

Vikram Atul Thakar, Ann Arbor, MI (US);

Adam Peczalski, Ann Arbor, MI (US);

Assignee:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Attorney:

Reising Ethington P.C.

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H03H 3/02 (2006.01); H01L 41/22 (2013.01); H01L 23/24 (2006.01); H01L 23/34 (2006.01); H01L 21/00 (2006.01); H01L 41/29 (2013.01); H03H 3/007 (2006.01); H03H 9/02 (2006.01); H03H 9/24 (2006.01);
U.S. Cl.
CPC ...
H03H 3/02 (2013.01); H01L 21/00 (2013.01); H01L 23/34 (2013.01); H01L 41/22 (2013.01); H01L 41/29 (2013.01); H03H 3/0076 (2013.01); H03H 9/02448 (2013.01); H01L 2924/0002 (2013.01); H03H 2003/021 (2013.01); H03H 2003/023 (2013.01); H03H 2009/02496 (2013.01); H03H 2009/02503 (2013.01); H03H 2009/2421 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49005 (2015.01); Y10T 29/4913 (2015.01);
Abstract

A method of making a temperature-compensated resonator is presented. The method comprises the steps of: (a) providing a substrate including a device layer; (b) replacing material from the device layer with material having an opposite temperature coefficient of elasticity (TCE) along a pre-determined region of high strain energy density for the resonator; (c) depositing a capping layer over the replacement material; and (d) etch-releasing the resonator from the substrate. The resonator may be a part of a micro electromechanical system (MEMS).

Find Patent Forward Citations

Raieszadeh, Mina. (2017). Method of manufacturing a temperature-compensated micromechanical resonator (U.S. Patent No. 9742373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9742373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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