The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Oct. 01, 2014
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Takeshi Kato, Hitachinaka, JP;

Masashige Tsuji, Hitachinaka, JP;

Satoshi Hiranuma, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 1/08 (2006.01); H02M 5/458 (2006.01); H02M 7/00 (2006.01); H03K 17/61 (2006.01);
U.S. Cl.
CPC ...
H02M 5/458 (2013.01); H02M 1/08 (2013.01); H02M 7/003 (2013.01); H03K 17/61 (2013.01); H03K 2217/0081 (2013.01);
Abstract

Provided is a driver board capable of miniaturizing itself while ensuring insulation voltage resistance performance. In the driver board: a transformeris configured, so as to cross a first insulating region, such that a primary side terminalis connected to a primary side circuitand a secondary side terminalis connected to a secondary side circuit; a power supply control ICis configured, so as to cross a insulating region, such that a primary side terminalis connected to a primary side circuitand a secondary side terminalis connected to a secondary side circuit; and the insulating regionand the insulating regionare formed so as to at least partially face each other via an insulating boardsuch that the primary side circuitand the secondary side circuitdo not face each other via the insulating board and the primary side circuitand the secondary side circuitdo not face each other via the insulating board.


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