The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Feb. 11, 2015
Applicant:
Sanyo Denki Co., Ltd., Tokyo, JP;
Inventors:
Toshihito Miyashita, Tokyo, JP;
Manabu Horiuchi, Tokyo, JP;
Assignee:
SANYO DENKI CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 5/22 (2006.01); H02K 11/00 (2016.01); H01R 4/02 (2006.01); H01R 4/64 (2006.01); H02K 11/40 (2016.01); H01R 11/11 (2006.01); H01R 13/04 (2006.01);
U.S. Cl.
CPC ...
H02K 11/0094 (2013.01); H01R 4/023 (2013.01); H01R 4/027 (2013.01); H01R 4/64 (2013.01); H02K 5/225 (2013.01); H02K 11/40 (2016.01); H01R 11/11 (2013.01); H01R 13/04 (2013.01); H01R 2201/10 (2013.01);
Abstract
A ground wire connection structure for a motor includes: a frame that has electrical conductivity; a flange that is integrated with the frame on one axial end surface of the frame and has electrical conductivity; a protrusion that is protruded outward from a flange surface of the flange and has a through hole; and a conductive pin that has a press-fit portion press-fitted and fixed into the through hole, a diameter-increased head portion, and a solder cup protruded from the head portion to allow an exposed tip end of a ground wire to be inserted and joined into the inside.